10018783-11010TLF
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Contact Material | Copper Alloy |
| Contact Plating | Gold |
| Mount | Through Hole |
| Mounting Type | Through Hole |
| Housing Material | Nylon |
| Material - Insulation | Polyamide (PA), Nylon, Glass Filled |
| Operating Temperature | -55°C~85°C |
| Packaging | Tray |
| Series | HPCE® |
| Feature | Board Lock, Locking Ramp |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Termination | Solder, Staggered |
| Connector Type | Cantilever |
| Number of Positions | 36 |
| Max Operating Temperature | 85°C |
| Min Operating Temperature | -55°C |
| Color | Black |
| Number of Rows | 2 |
| Gender | Female |
| Contact Type | Cantilever |
| Pitch | 0.039 1.00mm |
| Orientation | Straight |
| Current Rating | 1.1A |
| Contact Finish | Gold |
| Voltage - Rated AC | 300V |
| Number of Contacts | 36 |
| Housing Color | Black |
| Card Type | PCI Express™ |
| Read Out | Dual |
| Insulation Resistance | 1GOhm |
| Max Voltage Rating (AC) | 300V |
| Length | 25mm |
| Width | 7.4mm |
| Contact Finish Thickness | 30.0μin 0.76μm |
| Card Thickness | 0.062 1.57mm |
| Board Thickness | 2.36mm |
| RoHS Status | RoHS Compliant |
| Flammability Rating | UL94 V-0 |
| Lead Free | Lead Free |
10018783-11010TLF Overview
The material was packaged according to the specifications provided by Tray.You should mount it with type Through Hole.The device is connected via the connector socket Cantilever.Board Lock, Locking Ramp features are included in the device.It's the HPCE? that tells you which series it is.Operating at a maximum temperature of 85°C°C ensures stable performance.For it to work, it needs to stay below -55°C degrees Celsius.
10018783-11010TLF Features
HPCE? series
10018783-11010TLF Applications
There are a lot of Amphenol ICC (FCI) 10018783-11010TLF Edgeboard Connectors applications.
- Digital beam-forming systems for ultrasound
- Digital Storage Oscilloscope
- High Speed Data Acquisition for PCs
- GSM, EDGE, PHS, UMTS, WCDMA, CDMA2000,
- 3-phase power control
- Communication Systems
- Communications
- Scientific instruments
- High Speed Data Acquisition
- Imaging Systems
