10018783-11200TLF
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Contact Material | Copper Alloy |
| Contact Plating | Gold |
| Mount | Through Hole |
| Mounting Type | Through Hole |
| Housing Material | Nylon |
| Material - Insulation | Polyamide (PA), Nylon, Glass Filled |
| Operating Temperature | -55°C~85°C |
| Packaging | Tray |
| Series | HPCE® |
| Feature | Board Lock, Locking Ramp |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Termination | Solder, Staggered |
| Connector Type | Cantilever |
| Number of Positions | 36 |
| Max Operating Temperature | 85°C |
| Min Operating Temperature | -55°C |
| Color | Black |
| Number of Rows | 2 |
| Gender | Female |
| Contact Type | Cantilever |
| Pitch | 0.039 1.00mm |
| Orientation | Straight |
| Current Rating | 1.1A |
| Contact Finish | Gold |
| Voltage - Rated AC | 300V |
| Number of Contacts | 36 |
| Housing Color | Black |
| Card Type | PCI Express™ |
| Read Out | Dual |
| Insulation Resistance | 1GOhm |
| Max Voltage Rating (AC) | 300V |
| Length | 25mm |
| Width | 7.4mm |
| Contact Finish Thickness | Flash |
| Card Thickness | 0.062 1.57mm |
| Board Thickness | 1.56mm |
| RoHS Status | RoHS Compliant |
| Flammability Rating | UL94 V-0 |
| Lead Free | Lead Free |
10018783-11200TLF Overview
In accordance with Tray's specifications, the material was packaged.It's recommended to mount type Through Hole.Connecting the device is accomplished through the connector socket Cantilever.The device has Board Lock, Locking Ramp features.HPCE? tells you the series of the device.For stable operation, keep it at 85°C°C.In order to ensure their reliability, they require a minimum working temperature of -55°C degrees Celsius.
10018783-11200TLF Features
HPCE? series
10018783-11200TLF Applications
There are a lot of Amphenol ICC (FCI) 10018783-11200TLF Edgeboard Connectors applications.
- Audio/Video devices
- Cell Phones
- Imaging Systems
- Displaying
- Scientific instruments
- In-building wireless telephony
- Telecommunications
- Multicarrier, multimode digital receivers
- Broadband data applications
- Digital beam-forming systems for ultrasound
