Parameters |
Factory Lead Time |
1 Week |
Contact Material |
Copper Alloy |
Contact Plating |
Gold |
Mount |
Through Hole |
Mounting Type |
Through Hole |
Housing Material |
Nylon |
Material - Insulation |
Polyamide (PA), Nylon, Glass Filled |
Operating Temperature |
-55°C~85°C |
Packaging |
Tray |
Series |
HPCE® |
Feature |
Board Lock, Locking Ramp |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Termination |
Solder, Staggered |
Connector Type |
Cantilever |
Number of Positions |
64 |
Max Operating Temperature |
85°C |
Min Operating Temperature |
-55°C |
Color |
Black |
Number of Rows |
2 |
Gender |
Female |
Contact Type |
Cantilever |
Pitch |
0.039 1.00mm |
Orientation |
Straight |
Current Rating |
1.1A |
Contact Finish |
Gold |
Voltage - Rated AC |
300V |
Number of Contacts |
64 |
Housing Color |
Black |
Card Type |
PCI Express™ |
Read Out |
Dual |
Insulation Resistance |
1GOhm |
Number of Positions/Bay/Row |
11; 21 |
Max Voltage Rating (AC) |
300V |
Length |
39mm |
Width |
7.4mm |
Contact Finish Thickness |
Flash |
Card Thickness |
0.062 1.57mm |
Board Thickness |
1.56mm |
RoHS Status |
RoHS Compliant |
Flammability Rating |
UL94 V-0 |
Lead Free |
Lead Free |
10018783-11201TLF Overview
Packaged according to Tray's specs.You should mount it with type Through Hole.Connecting the device uses the connector socket Cantilever.This device has Board Lock, Locking Ramp features.HPCE? indicates that the device belongs to the series.This can be achieved by maintaining a maximum operating temperature of 85°C°C.In order to ensure that it is reliable, it must operate at a minimum temperature of -55°C degrees Celsius.
10018783-11201TLF Features
HPCE? series
10018783-11201TLF Applications
There are a lot of Amphenol ICC (FCI) 10018783-11201TLF Edgeboard Connectors applications.
- Cell Phones
- 4-channel data acquisition
- RADAR processing, digital oscilloscopes
- Uninterrupted Power Supplies
- Digital Multimeters, PLC's (Programming Logic Controllers)
- Displaying
- Rotary encoder
- Broadband data applications
- CMOS Image sensors for mobile applications
- Audio/Video devices