10018783-11211TLF
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Contact Material | Copper Alloy |
| Contact Plating | Gold |
| Mount | Through Hole |
| Mounting Type | Through Hole |
| Housing Material | Nylon |
| Material - Insulation | Polyamide (PA), Nylon, Glass Filled |
| Operating Temperature | -55°C~85°C |
| Packaging | Tray |
| Published | 2015 |
| Series | HPCE® |
| Feature | Board Lock, Locking Ramp |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Termination | Solder, Staggered |
| Connector Type | Cantilever |
| Number of Positions | 64 |
| Max Operating Temperature | 85°C |
| Min Operating Temperature | -55°C |
| Color | Black |
| Number of Rows | 2 |
| Gender | Female |
| Contact Type | Cantilever |
| Pitch | 0.039 1.00mm |
| Orientation | Straight |
| Current Rating | 1.1A |
| Contact Finish | Gold |
| Voltage - Rated AC | 300V |
| Number of Contacts | 64 |
| Housing Color | Black |
| Card Type | PCI Express™ |
| Read Out | Dual |
| Insulation Resistance | 1GOhm |
| Number of Positions/Bay/Row | 11; 21 |
| Max Voltage Rating (AC) | 300V |
| Length | 39mm |
| Width | 7.4mm |
| Contact Finish Thickness | Flash |
| Card Thickness | 0.062 1.57mm |
| Board Thickness | 2.36mm |
| RoHS Status | RoHS Compliant |
| Flammability Rating | UL94 V-0 |
| Lead Free | Lead Free |
10018783-11211TLF Overview
As per Tray's specifications, the material was packaged.It is recommended to mount the device using type Through Hole.Using the connector socket Cantilever is the device's method of connection.Board Lock, Locking Ramp features are available on the device.Device series is indicated by HPCE?.Stable operation requires 85°C°C as the max operating temperature.It must be operated at a minimum temperature of -55°C degrees Celsius in order to operate reliably.
10018783-11211TLF Features
HPCE? series
10018783-11211TLF Applications
There are a lot of Amphenol ICC (FCI) 10018783-11211TLF Edgeboard Connectors applications.
- Industrial Process Control
- Multicarrier, multimode digital receivers
- Communication Systems
- Imaging Systems
- Smart antenna systems
- Spectrum Analysis
- High Speed Data Acquisition for PCs
- Medical Imaging
- TD-SCDMA, WiMAX
- Communication test equipment
