10018783-11213TLF
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Contact Material | Copper Alloy |
| Contact Plating | Gold |
| Mount | Through Hole |
| Mounting Type | Through Hole |
| Housing Material | Nylon |
| Material - Insulation | Polyamide (PA), Nylon, Glass Filled |
| Operating Temperature | -55°C~85°C |
| Packaging | Tray |
| Series | HPCE® |
| Feature | Board Lock, Locking Ramp |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Termination | Solder, Staggered |
| Connector Type | Cantilever |
| Number of Positions | 164 |
| Max Operating Temperature | 85°C |
| Min Operating Temperature | -55°C |
| Color | Black |
| Number of Rows | 2 |
| Gender | Female |
| Contact Type | Cantilever |
| Pitch | 0.039 1.00mm |
| Orientation | Straight |
| Current Rating | 1.1A |
| Contact Finish | Gold |
| Voltage - Rated AC | 300V |
| Number of Contacts | 164 |
| Housing Color | Black |
| Card Type | PCI Express™ |
| Read Out | Dual |
| Insulation Resistance | 1GOhm |
| Max Voltage Rating (AC) | 300V |
| Length | 89mm |
| Width | 7.4mm |
| Contact Finish Thickness | Flash |
| Card Thickness | 0.062 1.57mm |
| Board Thickness | 2.36mm |
| RoHS Status | RoHS Compliant |
| Flammability Rating | UL94 V-0 |
| Lead Free | Lead Free |
10018783-11213TLF Overview
Packaging was done per Tray's specs.We recommend mounting type Through Hole.Connecting the device uses connector socket Cantilever.Board Lock, Locking Ramp features are on this device.HPCE? indicates the device's series number.Keeping the temperature below 85°C°C will make it stable.For it to work, it needs to stay below -55°C degrees Celsius.
10018783-11213TLF Features
HPCE? series
10018783-11213TLF Applications
There are a lot of Amphenol ICC (FCI) 10018783-11213TLF Edgeboard Connectors applications.
- Multicarrier, multimode digital receivers
- Telecommunications
- 3-phase power control
- 4-channel data acquisition
- Instrumentation and test equipment
- Micro and pico cell systems, software radios
- Communication test equipment
- Audio/Video devices
- Communication Systems
- Digital signal processing
