10018783-12003TLF
| Parameters | |
|---|---|
| Feature | Board Guide, Locking Ramp |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Termination | Solder, Staggered |
| Connector Type | Cantilever |
| Number of Positions | 164 |
| Max Operating Temperature | 85°C |
| Min Operating Temperature | -55°C |
| Color | Black |
| Number of Rows | 2 |
| Gender | Female |
| Contact Type | Cantilever |
| Pitch | 0.039 1.00mm |
| Orientation | Straight |
| Current Rating | 1.1A |
| Contact Finish | Gold |
| Voltage - Rated AC | 300V |
| Number of Contacts | 164 |
| Housing Color | Black |
| Card Type | PCI Express™ |
| Read Out | Dual |
| Insulation Resistance | 1GOhm |
| Max Voltage Rating (AC) | 300V |
| Length | 89mm |
| Width | 7.4mm |
| Contact Finish Thickness | 30.0μin 0.76μm |
| Card Thickness | 0.062 1.57mm |
| Board Thickness | 1.56mm |
| RoHS Status | RoHS Compliant |
| Flammability Rating | UL94 V-0 |
| Lead Free | Lead Free |
| Factory Lead Time | 1 Week |
| Contact Material | Copper Alloy |
| Contact Plating | Gold |
| Mount | Through Hole |
| Mounting Type | Through Hole |
| Housing Material | Nylon |
| Material - Insulation | Polyamide (PA), Nylon, Glass Filled |
| Operating Temperature | -55°C~85°C |
| Packaging | Tray |
| Series | HPCE® |
10018783-12003TLF Overview
We packaged the material in accordance with Tray's specifications.The mount type Through Hole is recommended.The device is connected using the connector socket Cantilever.Board Guide, Locking Ramp features are present on the device.The HPCE? indicates the series number of the device.This allows stable operation up to 85°C°C.In order to ensure that it is reliable, it must operate at a minimum temperature of -55°C degrees Celsius.
10018783-12003TLF Features
HPCE? series
10018783-12003TLF Applications
There are a lot of Amphenol ICC (FCI) 10018783-12003TLF Edgeboard Connectors applications.
- Communication Systems
- Battery Operated Systems
- Digital beam-forming systems for ultrasound
- Music reproduction technology
- Automotive
- Wireless local loop
- Transducer
- Medical Imaging
- Microcontrollers.
- Cell Phones
