10018784-10002TLF
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Contact Material | Copper Alloy |
| Contact Plating | Gold |
| Mount | Through Hole |
| Mounting Type | Through Hole |
| Housing Material | Nylon |
| Material - Insulation | Polyamide (PA), Nylon, Glass Filled |
| Operating Temperature | -55°C~85°C |
| Packaging | Tray |
| Series | HPCE® |
| Feature | Board Guide, Locking Ramp |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Termination | Solder |
| Connector Type | Cantilever |
| Number of Positions | 98 |
| Max Operating Temperature | 85°C |
| Min Operating Temperature | -55°C |
| Color | Black |
| Number of Rows | 2 |
| Gender | Female |
| Contact Type | Cantilever |
| Pitch | 0.039 1.00mm |
| Orientation | Straight |
| Current Rating | 1.1A |
| Contact Finish | Gold |
| Voltage - Rated AC | 300V |
| Number of Contacts | 98 |
| Housing Color | Black |
| Contact Resistance | 40mOhm |
| Card Type | PCI Express™ |
| Read Out | Dual |
| Insulation Resistance | 1GOhm |
| Max Voltage Rating (AC) | 300V |
| Length | 56mm |
| Width | 7.4mm |
| Contact Finish Thickness | 30.0μin 0.76μm |
| Card Thickness | 0.062 1.57mm |
| Board Thickness | 1.56mm |
| RoHS Status | RoHS Compliant |
| Flammability Rating | UL94 V-0 |
| Lead Free | Lead Free |
10018784-10002TLF Overview
A package was prepared according to Tray's specifications.We recommend mounting type Through Hole.The device is connected via the connector socket Cantilever.A device with Board Guide, Locking Ramp features is available.A HPCE? means the device is a series device.The maximum operating temperature of 85°C°C allows for stable operation.For reliability, it needs to be at -55°C degrees Celsius.
10018784-10002TLF Features
HPCE? series
10018784-10002TLF Applications
There are a lot of Amphenol ICC (FCI) 10018784-10002TLF Edgeboard Connectors applications.
- Music recording
- TD-SCDMA, WiMAX
- Telecommunications
- Digital beam-forming systems for ultrasound
- Smart antenna systems
- Communication Systems
- Medical Instrumentation and medical imaging
- CMOS Image sensors for mobile applications
- Music reproduction technology
- Broadband data applications
