10018784-10102TLF
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Contact Material | Copper Alloy |
| Contact Plating | Gold |
| Mount | Through Hole |
| Mounting Type | Through Hole |
| Housing Material | Nylon |
| Material - Insulation | Polyamide (PA), Nylon, Glass Filled |
| Operating Temperature | -55°C~85°C |
| Packaging | Tray |
| Published | 2015 |
| Series | HPCE® |
| Feature | Board Guide, Locking Ramp |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Termination | Solder |
| Connector Type | Cantilever |
| Number of Positions | 98 |
| Max Operating Temperature | 85°C |
| Min Operating Temperature | -55°C |
| Color | Black |
| Number of Rows | 2 |
| Gender | Female |
| Contact Type | Cantilever |
| Pitch | 0.039 1.00mm |
| Orientation | Straight |
| Current Rating | 1.1A |
| Contact Finish | Gold |
| Voltage - Rated AC | 300V |
| Number of Contacts | 98 |
| Housing Color | Black |
| Card Type | PCI Express™ |
| Read Out | Dual |
| Insulation Resistance | 1GOhm |
| Max Voltage Rating (AC) | 300V |
| Length | 56mm |
| Width | 7.4mm |
| Contact Finish Thickness | 15.0μin 0.38μm |
| Card Thickness | 0.062 1.57mm |
| Board Thickness | 1.56mm |
| RoHS Status | RoHS Compliant |
| Flammability Rating | UL94 V-0 |
| Lead Free | Lead Free |
10018784-10102TLF Overview
In accordance with Tray's specifications, the material was packaged.It's best to mount type Through Hole.The device is connected using the connector socket Cantilever.Feature-wise, the device has Board Guide, Locking Ramp.HPCE? tells you what series the device is.An operating temperature of [0°C] ensures stable operation.Ensure its reliability by working at a minimum temperature of -55°C degrees Celsius.
10018784-10102TLF Features
HPCE? series
10018784-10102TLF Applications
There are a lot of Amphenol ICC (FCI) 10018784-10102TLF Edgeboard Connectors applications.
- Digital signal processing
- GSM, EDGE, PHS, UMTS, WCDMA, CDMA2000,
- Data Acquisition Systems
- High Speed Data Acquisition
- Automotive
- Smart antenna systems
- CMOS Image sensors for mobile applications
- Transducer
- Digital beam-forming systems for ultrasound
- Medical Imaging
