10053363-200LF
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Contact Material | Copper Alloy |
| Contact Plating | Gold |
| Mount | Through Hole |
| Mounting Type | Through Hole, Right Angle |
| Housing Material | Thermoplastic |
| Material - Insulation | Thermoplastic |
| Packaging | Tray |
| Published | 2012 |
| Series | HPCE® |
| Feature | Board Guide |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Termination | Solder |
| Connector Type | Cantilever |
| Number of Positions | 64 (Power) |
| Max Operating Temperature | 105°C |
| Min Operating Temperature | -5°C |
| Color | Black |
| Number of Rows | 2 |
| Gender | Female |
| Contact Type | Cantilever |
| Pitch | 0.100 2.54mm |
| Orientation | Right Angle |
| Current Rating | 7A |
| Contact Finish | Gold |
| Voltage - Rated AC | 1kV |
| Number of Contacts | 64 |
| Housing Color | Black |
| Contact Resistance | 55mOhm |
| Card Type | Non Specified - Dual Edge |
| Read Out | Dual |
| Insulation Resistance | 5GOhm |
| Number of Positions/Bay/Row | 32 |
| Row Spacing | 3.8 mm |
| Contact Finish Thickness | 30.0μin 0.76μm |
| Card Thickness | 0.062 1.57mm |
| Radiation Hardening | No |
| REACH SVHC | No SVHC |
| RoHS Status | RoHS Compliant |
| Lead Free | Lead Free |
10053363-200LF Overview
The material was packaged in accordance with the specifications provided by Tray.The mount type Through Hole, Right Angle is recommended.Devices are connected through connector sockets Cantilever.Board Guide features are on this device.Device series is indicated by HPCE?.A temperature of 105°C°C is the maximum operating temperature.Ensure its reliability by working at a minimum temperature of -5°C degrees Celsius.
10053363-200LF Features
HPCE? series
10053363-200LF Applications
There are a lot of Amphenol ICC (FCI) 10053363-200LF Edgeboard Connectors applications.
- Medical Imaging
- Microcontrollers.
- In-building wireless telephony
- Audio/Video devices
- Data Acquisition Systems
- Handheld Terminal Interface
- Wireless and wired broadband communications
- TD-SCDMA, WiMAX
- Instrumentation and test equipment
- RADAR processing, digital oscilloscopes
