10AS016E3F27I1HG
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Package / Case | 672-BBGA, FCBGA |
| Operating Temperature | -40°C~100°C TJ |
| Packaging | Tray |
| Series | Arria 10 SX |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of I/O | 240 |
| Speed | 1.5GHz |
| RAM Size | 256KB |
| Core Processor | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
| Peripherals | DMA, POR, WDT |
| Connectivity | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Architecture | MCU, FPGA |
| Primary Attributes | FPGA - 160K Logic Elements |
| RoHS Status | RoHS Compliant |
This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).
A core processor(s) Dual ARM? Cortex?-A9 MPCore? with CoreSight? is integrated into this SoC.The manufacturer assigns this system on a chip with a 672-BBGA, FCBGA package as per the manufacturer's specifications.With 256KB RAM implemented, this SoC chip provides users with a high level of performance.The internal architecture of this SoC design utilizes the MCU, FPGA technique.In the Arria 10 SX series, this system on chip SoC is included.As a rule of thumb, the average operating temperature for this SoC meaning should be -40°C~100°C TJ.A key point to note is that this SoC security combines FPGA - 160K Logic Elements.This SoC system on a chip has been designed in a state-of-the-art Tray package.As a whole, this SoC part is comprised of 240 inputs and outputs.
Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
There are a lot of Intel
10AS016E3F27I1HG System On Chip (SoC) applications.
- RISC-V
- Smartphone accessories
- Multiprocessor system-on-chips (MPSoCs)
- Mobile computing
- Vending machines
- Keywords
- Temperature Sensors
- PC peripherals
- Keyboard
- Body control module
