10AS022E3F27I1HG
| Parameters | |
|---|---|
| Package / Case | 672-BBGA, FCBGA |
| Operating Temperature | -40°C~100°C TJ |
| Packaging | Tray |
| Series | Arria 10 SX |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of I/O | 240 |
| Speed | 1.5GHz |
| RAM Size | 256KB |
| Core Processor | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
| Peripherals | DMA, POR, WDT |
| Connectivity | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Architecture | MCU, FPGA |
| Primary Attributes | FPGA - 220K Logic Elements |
| RoHS Status | RoHS Compliant |
This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).
On this SoC, there is Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor.This system on a chip is packaged as 672-BBGA, FCBGA by the manufacturer.As this SoC chip has 256KB RAM implemented, it provides reliable performance to its users.The SoC design uses MCU, FPGA architecture for its internal architecture.It is a member of the Arria 10 SX series.Temperatures should be -40°C~100°C TJ on average for this SoC meaning.This SoC security combines FPGA - 220K Logic Elements and that is something to note.Housed in the state-of-art Tray package.In total, this SoC part has 240 I/Os.
Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
There are a lot of Intel
10AS022E3F27I1HG System On Chip (SoC) applications.
- ARM
- Industrial sectors
- Communication network-on-Chip (cNoC)
- Vending machines
- Networked sensors
- POS Terminals
- Industrial robot
- Industrial
- Medical Pressure
- Smart appliances
