10AS022E3F29E1HG
| Parameters | |
|---|---|
| Package / Case | 780-BBGA, FCBGA |
| Operating Temperature | 0°C~100°C TJ |
| Packaging | Tray |
| Series | Arria 10 SX |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of I/O | 288 |
| Speed | 1.5GHz |
| RAM Size | 256KB |
| Core Processor | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
| Peripherals | DMA, POR, WDT |
| Connectivity | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Architecture | MCU, FPGA |
| Primary Attributes | FPGA - 220K Logic Elements |
| RoHS Status | RoHS Compliant |
This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).
On this SoC, there is Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor.There is a 780-BBGA, FCBGA package assigned to this system on a chip by the manufacturer.With 256KB RAM implemented, this SoC chip provides users with reliable performance.The internal architecture of this SoC design is based on the MCU, FPGA technique.It is a member of the Arria 10 SX series.It is recommended that this SoC meaning be operated at 0°C~100°C TJ on an average.A key point to note is that this SoC security combines FPGA - 220K Logic Elements.Tray package houses this SoC system on a chip.As a whole, this SoC part includes 288 I/Os.
Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
There are a lot of Intel
10AS022E3F29E1HG System On Chip (SoC) applications.
- ARM
- Samsung galaxy gear
- ARM processors
- Sports
- Communication network-on-Chip (cNoC)
- Industrial sectors
- Test and Measurement
- Defense
- Microcontroller
- Multiprocessor system-on-chips (MPSoCs)
