Parameters |
Package / Case |
780-BBGA, FCBGA |
Operating Temperature |
0°C~100°C TJ |
Packaging |
Tray |
Series |
Arria 10 SX |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Number of I/O |
360 |
Speed |
1.5GHz |
RAM Size |
256KB |
Core Processor |
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
Peripherals |
DMA, POR, WDT |
Connectivity |
EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Architecture |
MCU, FPGA |
Primary Attributes |
FPGA - 270K Logic Elements |
RoHS Status |
RoHS Compliant |
This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).
This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).Manufacturer assigns package 780-BBGA, FCBGA to this system on a chip.This SoC chip is equipped with 256KB RAM and guarantees reliable performance to the user.Using the MCU, FPGA technique, this SoC design's internal architecture is simple.A system on chip SoC of this type belongs to the Arria 10 SX series.Typical operating temperatures for this SoC meaning should be 0°C~100°C TJ.As one of the most important things to note is that this SoC security combines FPGA - 270K Logic Elements together.In the state-of-the-art Tray package, this SoC system on a chip is housed.360 I/Os are available in this SoC part.
Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
There are a lot of Intel
10AS027E1F29E1HG System On Chip (SoC) applications.
- Temperature
- Cyber security for critical applications in the aerospace
- ARM processors
- Keywords
- Remote control
- Smart appliances
- Industrial AC-DC
- Functional safety for critical applications in the industrial sectors
- AC-input BLDC motor drive
- Industrial transport