Parameters |
Package / Case |
672-BBGA, FCBGA |
Operating Temperature |
0°C~100°C TJ |
Packaging |
Tray |
Series |
Arria 10 SX |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Number of I/O |
240 |
Speed |
1.5GHz |
RAM Size |
256KB |
Core Processor |
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
Peripherals |
DMA, POR, WDT |
Connectivity |
EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Architecture |
MCU, FPGA |
Primary Attributes |
FPGA - 270K Logic Elements |
RoHS Status |
RoHS Compliant |
This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).
This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).According to the manufacturer, this system on a chip has a package of 672-BBGA, FCBGA.With 256KB RAM implemented, this SoC chip provides users with reliable performance.In terms of internal architecture, this SoC design uses the MCU, FPGA method.Arria 10 SX is the series number of this system on chip SoC.This SoC meaning should have an average operating temperature of 0°C~100°C TJ when it is operating normally.Taking note of the fact that this SoC security combines FPGA - 270K Logic Elements is important.There is a state-of-the-art Tray package that houses this SoC system on a chip.An integral part of this SoC consists of a total of 240 I/Os.
Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
There are a lot of Intel
10AS027E2F27E1HG System On Chip (SoC) applications.
- Keyboard
- Smart appliances
- Communication interfaces ( I2C, SPI )
- Networked sensors
- Networked Media Encode/Decode
- Remote control
- Functional safety for critical applications in the aerospace
- Keywords
- External USB hard disk/SSD
- Cyberphysical system-on-chip