Parameters |
Factory Lead Time |
1 Week |
Package / Case |
780-BBGA, FCBGA |
Operating Temperature |
0°C~100°C TJ |
Packaging |
Tray |
Series |
Arria 10 SX |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Number of I/O |
360 |
Speed |
1.5GHz |
RAM Size |
256KB |
Core Processor |
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
Peripherals |
DMA, POR, WDT |
Connectivity |
EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Architecture |
MCU, FPGA |
Primary Attributes |
FPGA - 270K Logic Elements |
RoHS Status |
RoHS Compliant |
This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).
This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).Package 780-BBGA, FCBGA is assigned to this system on a chip by the manufacturer.The 256KB RAM implementation of this SoC chip ensures efficient performance for users.Using the MCU, FPGA technique, this SoC design's internal architecture is simple.It is part of the Arria 10 SX series of system on a chips.Typical operating temperatures for this SoC meaning should be 0°C~100°C TJ.Taking note of the fact that this SoC security combines FPGA - 270K Logic Elements is important.An advanced Tray package houses this SoC system on a chip.As a whole, this SoC part is comprised of 360 inputs and outputs.
Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
There are a lot of Intel
10AS027E2F29E1HG System On Chip (SoC) applications.
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