Parameters |
Factory Lead Time |
1 Week |
Package / Case |
780-BBGA, FCBGA |
Operating Temperature |
0°C~100°C TJ |
Packaging |
Tray |
Series |
Arria 10 SX |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Number of I/O |
360 |
Speed |
1.5GHz |
RAM Size |
256KB |
Core Processor |
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
Peripherals |
DMA, POR, WDT |
Connectivity |
EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Architecture |
MCU, FPGA |
Primary Attributes |
FPGA - 480K Logic Elements |
RoHS Status |
RoHS Compliant |
This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).
This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).It has been assigned a package 780-BBGA, FCBGA by its manufacturer for this system on a chip.With 256KB RAM implemented, this SoC chip provides users with a high level of performance.The internal architecture of this SoC design is based on the MCU, FPGA technique.In the Arria 10 SX series, this system on chip SoC is included.It is expected that this SoC meaning will operate at 0°C~100°C TJ on average.Taking note of the fact that this SoC security combines FPGA - 480K Logic Elements is important.Featured in the state-of-the-art Tray package, this SoC system on a chip provides outstanding performance.360 I/Os in total are included in this SoC part.
Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
There are a lot of Intel
10AS048E1F29E1HG System On Chip (SoC) applications.
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