10AX032E1F27E1HG
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Mounting Type | Surface Mount |
| Package / Case | 672-BBGA, FCBGA |
| Supplier Device Package | 672-FBGA (27x27) |
| Operating Temperature | 0°C~100°C TJ |
| Packaging | Tray |
| Series | Arria 10 GX |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Voltage - Supply | 0.87V~0.98V |
| Number of I/O | 240 |
| Number of Logic Elements/Cells | 320000 |
| Total RAM Bits | 21040128 |
| Number of LABs/CLBs | 119900 |
| RoHS Status | RoHS Compliant |
10AX032E1F27E1HG Overview
Fpga chips is supplied in the 672-BBGA, FCBGA package. The I/Os are designed to facilitate a more coherent transfer of data. A fundamental building block is made up of 320000 logic elements/cells. Surface Mount-connectors can be used to attach this FPGA module to the development board. This device is powered by a 0.87V~0.98V battery. The FPGA belongs to the Arria 10 GX series of FPGAs, and it is one type of FPGA. Fpga chips is necessary to keep the operating temperature wFpga chipshin 0°C~100°C TJ when the device is operating. Fpga chips is designed to maximiTraye space efficiency by containing the FPGA model in Tray. Fpga chips is important to note that this device has a RAM capacFpga chipsy of 21040128 bFpga chipss. The FPGA is built as an array of 119900 latches or CLBs. As a supplier, 672-FBGA (27x27) is responsible for the package of its devices.
10AX032E1F27E1HG Features
240 I/Os
Up to 21040128 RAM bits
10AX032E1F27E1HG Applications
There are a lot of Intel 10AX032E1F27E1HG FPGAs applications.
- Camera time adjustments
- Data center hardware accelerators
- Data center search engines
- Medical Electronics
- Enterprise networking
- Automotive
- Software-defined radios
- Server Applications
- Computer hardware emulation
- Embedded Vision
