10CL006YU256C8G
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Mounting Type | Surface Mount |
| Package / Case | 256-LFBGA |
| Surface Mount | YES |
| Operating Temperature | 0°C~85°C TJ |
| Packaging | Tray |
| Series | Cyclone® 10 LP |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 256 |
| Voltage - Supply | 1.2V |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Supply Voltage | 1.2V |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| JESD-30 Code | S-PBGA-B256 |
| Number of I/O | 176 |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
| Number of Logic Elements/Cells | 6272 |
| Total RAM Bits | 276480 |
| Number of LABs/CLBs | 392 |
| Number of CLBs | 392 |
| RoHS Status | RoHS Compliant |
10CL006YU256C8G Overview
As part of the 256-LFBGA package, it is included. FPGAs of this type consist of FIELD PROGRAMMABLE GATE ARRAY components. Its 176 I/Os help it transfer data more efficiently. To form a fundamental building block, there are 6272 logic elements/cells. In order for the device to operate, a supply voltage of 1.2V volts needs to be provided. An attachment Surface Mount allows the FPGA module to be attached to the development board. Fpga chips operates at a voltage of 1.2V and uses a battery to supply power. It is a type of FPGA belonging to the Cyclone? 10 LP seies. Fpga chips is important to maintain the operating temperature wFpga chipshin the range of 0°C~85°C TJ when operating the machine. It is for space saving reasons that this FPGA model is contained in Tray. The total number of terminations is 256. There are 276480 RAM bits that are available with this device. 392 LABs/CLBs are configured on this FPGA. An architecture consists of 392 CLBs.
10CL006YU256C8G Features
176 I/Os
Up to 276480 RAM bits
10CL006YU256C8G Applications
There are a lot of Intel 10CL006YU256C8G FPGAs applications.
- Device controllers
- Video & Image Processing
- Audio
- ASIC prototyping
- Automotive Applications
- Solar Energy
- Server Applications
- Development Boards and Shields for Microcontrollers
- Data center hardware accelerators
- Medical imaging
