10M02SCM153C8G
| Parameters | |
|---|---|
| Number of I/O | 112 |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
| Number of Logic Elements/Cells | 2000 |
| Total RAM Bits | 110592 |
| Number of LABs/CLBs | 125 |
| RoHS Status | RoHS Compliant |
| Factory Lead Time | 1 Week |
| Mounting Type | Surface Mount |
| Package / Case | 153-VFBGA |
| Surface Mount | YES |
| Operating Temperature | 0°C~85°C TJ |
| Packaging | Tray |
| Series | MAX® 10 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 153 |
| HTS Code | 8542.39.00.01 |
| Voltage - Supply | 2.85V~3.465V |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| JESD-30 Code | S-PBGA-B153 |
10M02SCM153C8G Overview
There are two packages that contain fpga chips: 153-VFBGA package and X package. This kind of FPGA is composed of FIELD PROGRAMMABLE GATE ARRAY. Having 112 I/Os makes data transfers more coherent. A fundamental building block contains 2000 logic elements or cells. The Surface Mount-slot on the development board allows you to attach the FPGA module. With a supply voltage of 2.85V~3.465V, this device operates with ease. There are many types of FPGAs in the MAX? 10 series, this is one of them. Fpga chips is important to maintain the operating temperature wFpga chipshin the range of 0°C~85°C TJ when operating the machine. There is an FPGA model contained in Tray in order to conserve space. Fpga chips is designed wFpga chipsh 153 terminations. As far as the RAM bits are concerned, this device offers you a total of 110592. 125 LABs and CLBs are built into this FPGA.
10M02SCM153C8G Features
112 I/Os
Up to 110592 RAM bits
10M02SCM153C8G Applications
There are a lot of Intel 10M02SCM153C8G FPGAs applications.
- Security systems
- Random logic
- Medical Electronics
- Wireless Communications
- Filtering and communication encoding
- High Performance Computing
- Industrial Ethernet
- Secure Communication
- Distributed Monetary Systems
- Electronic Warfare
