10M16SAE144C8G
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Mounting Type | Surface Mount |
| Package / Case | 144-LQFP Exposed Pad |
| Surface Mount | YES |
| Operating Temperature | 0°C~85°C TJ |
| Packaging | Tray |
| Series | MAX® 10 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 144 |
| Voltage - Supply | 2.85V~3.465V |
| Terminal Position | QUAD |
| Terminal Form | GULL WING |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| JESD-30 Code | S-PQFP-G144 |
| Number of I/O | 101 |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
| Number of Logic Elements/Cells | 16000 |
| Total RAM Bits | 562176 |
| Number of LABs/CLBs | 1000 |
| RoHS Status | RoHS Compliant |
10M16SAE144C8G Overview
Fpga chips is supplied in the 144-LQFP Exposed Pad package. This kind of FPGA is composed of FIELD PROGRAMMABLE GATE ARRAY. This device features 101 I/Os in order to transfer data in a more efficient manner. In order to construct a fundamental building block, 16000 logic elements/cells are required. FPGA modules can be attached to development boards using a Surface Mount-connector. There is a 2.85V~3.465V-volt supply voltage required for the device to operate. It is a type of FPGA belonging to the MAX? 10 seies. In order to ensure a safe and efficient operation, it is important to maintain a temperature within 0°C~85°C TJ at all times. As a result of space limitations, this FPGA model has been included in Tray. Fpga chips is designed wFpga chipsh 144 terminations. This device has 562176 RAM bits, which is the number of RAM bits that this device offers. The FPGA is built as an array of 1000 latches or CLBs.
10M16SAE144C8G Features
101 I/Os
Up to 562176 RAM bits
10M16SAE144C8G Applications
There are a lot of Intel 10M16SAE144C8G FPGAs applications.
- Audio
- Military DSP
- Digital signal processing
- Broadcast
- Telecommunication
- Automotive advanced driver assistance systems (ADAS)
- Data Center
- Wired Communications
- Data center hardware accelerators
- Bioinformatics
