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110-91-328-41-001000

CONN IC DIP SOCKET 28POS GOLD


  • Manufacturer: Mill-Max Manufacturing Corp.
  • Nocochips NO: 520-110-91-328-41-001000
  • Package: -
  • Datasheet: -
  • Stock: 794
  • Description: CONN IC DIP SOCKET 28POS GOLD (Kg)

Details

Tags

Parameters
RoHS Status Non-RoHS Compliant
Lead Free Contains Lead
Factory Lead Time 1 Week
Mount Through Hole
Mounting Type Through Hole
Number of Pins 28
Insulation Material Polychlorinated
Housing Material Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Number of Positions or Pins (Grid) 28 (2 x 14)
Contact Material - Mating Beryllium Copper
Contact Material - Post Brass Alloy
Operating Temperature -55°C~125°C
Packaging Tube
Published 2013
Series 110
JESD-609 Code e0
Feature Open Frame
Pbfree Code no
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
ECCN Code EAR99
Type DIP, 0.3 (7.62mm) Row Spacing
Number of Rows 2
Additional Feature DIP SOCKET
HTS Code 8536.90.40.00
Voltage - Rated DC 150V
Contact Finish - Mating Gold
Orientation Straight
Depth 10.16mm
Current Rating 3A
Pitch - Mating 0.100 2.54mm
Voltage - Rated AC 100V
Number of Contacts 28
Contact Finish - Post Tin-Lead
Contact Resistance 10mOhm
Insulation Resistance 10GOhm
Row Spacing 7.62 mm
Termination Post Length 0.125 3.18mm
Pitch - Post 0.100 2.54mm
Length 35.5mm
Contact Finish Thickness - Mating 10.0μin 0.25μm
Contact Finish Thickness - Post 200.0μin 5.08μm
Radiation Hardening No
See Relate Datesheet

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