110-93-324-41-801000
| Parameters | |
|---|---|
| Feature | Open Frame, Decoupling Capacitor |
| Pbfree Code | no |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Termination | Solder |
| ECCN Code | EAR99 |
| Type | DIP, 0.3 (7.62mm) Row Spacing |
| Number of Positions | 24 |
| Number of Rows | 2 |
| Additional Feature | LOW PROFILE |
| HTS Code | 8536.90.40.00 |
| Voltage - Rated DC | 150V |
| Contact Finish - Mating | Gold |
| Orientation | Straight |
| Depth | 10.1mm |
| Current Rating | 3A |
| Pitch - Mating | 0.100 2.54mm |
| Voltage - Rated AC | 667mV |
| Lead Pitch | 2.54mm |
| Number of Contacts | 24 |
| Contact Finish - Post | Tin-Lead |
| Contact Resistance | 10mOhm |
| Insulation Resistance | 10GOhm |
| Row Spacing | 7.62 mm |
| Termination Post Length | 0.125 3.18mm |
| Pitch - Post | 0.100 2.54mm |
| Length | 30.48mm |
| Width | 10.16mm |
| Contact Finish Thickness - Mating | 30.0μin 0.76μm |
| Contact Finish Thickness - Post | 200.0μin 5.08μm |
| REACH SVHC | Unknown |
| RoHS Status | Non-RoHS Compliant |
| Flammability Rating | UL94 V-0 |
| Lead Free | Contains Lead |
| Factory Lead Time | 1 Week |
| Contact Material | Copper |
| Contact Plating | Gold, Tin |
| Mount | Surface Mount, Through Hole |
| Mounting Type | Through Hole |
| Package / Case | DIP |
| Insulation Material | Polychlorinated |
| Housing Material | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
| Body Material | Polyester |
| Number of Positions or Pins (Grid) | 24 (2 x 12) |
| Contact Material - Mating | Beryllium Copper |
| Contact Material - Post | Brass Alloy |
| Operating Temperature | -55°C~125°C |
| Packaging | Tube |
| Published | 2009 |
| Series | 110 |
| JESD-609 Code | e0 |
See Relate Datesheet
