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111-93-308-41-001000

Conn IC Socket DIP 8 Open 111 Series Thru-Hole 0.3" 0.1" Pin Spcng Straight 3A


  • Manufacturer: Mill-Max Manufacturing Corp.
  • Nocochips NO: 520-111-93-308-41-001000
  • Package: DIP
  • Datasheet: -
  • Stock: 880
  • Description: Conn IC Socket DIP 8 Open 111 Series Thru-Hole 0.3" 0.1" Pin Spcng Straight 3A (Kg)

Details

Tags

Parameters
Factory Lead Time 1 Week
Contact Material Copper
Mount Through Hole
Mounting Type Through Hole
Package / Case DIP
Insulation Material Polychlorinated
Housing Material Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Body Material PBT, Polybutylene, Polyester
Number of Positions or Pins (Grid) 8 (2 x 4)
Contact Material - Mating Beryllium Copper
Contact Material - Post Brass Alloy
Operating Temperature -55°C~125°C
Packaging Tube
Published 2010
Series 111
JESD-609 Code e0
Feature Open Frame
Pbfree Code no
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
ECCN Code EAR99
Connector Type DIP, Socket
Type DIP, 0.3 (7.62mm) Row Spacing
Number of Positions 8
Number of Rows 2
Additional Feature 94V-0
Voltage - Rated DC 150V
Contact Finish - Mating Gold
Orientation Straight
Depth 10.16mm
Current Rating 3A
Pitch - Mating 0.100 2.54mm
Voltage - Rated AC 667mV
Lead Pitch 2.54mm
Number of Contacts 8
Contact Finish - Post Tin-Lead
Contact Resistance 10mOhm
Insulation Resistance 10GOhm
Row Spacing 7.62 mm
Termination Post Length 0.125 3.18mm
Pitch - Post 0.100 2.54mm
Length 10.16mm
Width 10.16mm
Contact Finish Thickness - Mating 30.0μin 0.76μm
Contact Finish Thickness - Post 200.0μin 5.08μm
REACH SVHC Unknown
RoHS Status Non-RoHS Compliant
Flammability Rating UL94 V-0
Lead Free Contains Lead
See Relate Datesheet

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