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111-93-640-41-001000

CONN IC DIP SOCKET 40POS GOLD


  • Manufacturer: Mill-Max Manufacturing Corp.
  • Nocochips NO: 520-111-93-640-41-001000
  • Package: DIP
  • Datasheet: -
  • Stock: 709
  • Description: CONN IC DIP SOCKET 40POS GOLD (Kg)

Details

Tags

Parameters
Insulation Resistance 10GOhm
Row Spacing 15.24 mm
Termination Post Length 0.125 3.18mm
Pitch - Post 0.100 2.54mm
Length 50.8mm
Width 17.78mm
Contact Finish Thickness - Mating 30.0μin 0.76μm
Contact Finish Thickness - Post 200.0μin 5.08μm
RoHS Status Non-RoHS Compliant
Flammability Rating UL94 V-0
Lead Free Contains Lead
Factory Lead Time 1 Week
Contact Material Copper
Contact Plating Gold, Tin
Mount Through Hole
Mounting Type Through Hole
Package / Case DIP
Insulation Material Polychlorinated
Housing Material Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Body Material PBT, Polybutylene, Polyester
Number of Positions or Pins (Grid) 40 (2 x 20)
Contact Material - Mating Beryllium Copper
Contact Material - Post Brass Alloy
Operating Temperature -55°C~125°C
Packaging Tube
Published 2010
Series 111
JESD-609 Code e0
Feature Open Frame
Pbfree Code no
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
ECCN Code EAR99
Type DIP, 0.6 (15.24mm) Row Spacing
Number of Positions 40
Number of Rows 2
Additional Feature 94V-0
Voltage - Rated DC 150V
Contact Finish - Mating Gold
Orientation Straight
Depth 17.78mm
Current Rating 3A
Pitch - Mating 0.100 2.54mm
Voltage - Rated AC 100V
Lead Pitch 2.54mm
Number of Contacts 40
Contact Finish - Post Tin-Lead
Contact Resistance 10mOhm
See Relate Datesheet

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