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115-93-320-41-001000

CONN IC DIP SOCKET 20POS GOLD


  • Manufacturer: Mill-Max Manufacturing Corp.
  • Nocochips NO: 520-115-93-320-41-001000
  • Package: DIP
  • Datasheet: -
  • Stock: 310
  • Description: CONN IC DIP SOCKET 20POS GOLD (Kg)

Details

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Parameters
Number of Positions or Pins (Grid) 20 (2 x 10)
Contact Material - Mating Beryllium Copper
Contact Material - Post Brass Alloy
Operating Temperature -55°C~125°C
Packaging Tube
Published 2006
Series 115
JESD-609 Code e0
Feature Open Frame
Pbfree Code no
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
ECCN Code EAR99
Type DIP, 0.3 (7.62mm) Row Spacing
Number of Positions 20
Number of Rows 2
HTS Code 8536.90.40.00
Voltage - Rated DC 150V
Contact Finish - Mating Gold
Orientation Straight
Depth 10.16mm
Current Rating 3A
Pitch - Mating 0.100 2.54mm
Voltage - Rated AC 100V
Lead Pitch 2.54mm
Number of Contacts 20
Contact Finish - Post Tin-Lead
Contact Resistance 10mOhm
Insulation Resistance 10GOhm
Row Spacing 7.62 mm
Termination Post Length 0.108 2.74mm
Pitch - Post 0.100 2.54mm
Length 25.4mm
Width 10.16mm
Contact Finish Thickness - Mating 30.0μin 0.76μm
Contact Finish Thickness - Post 200.0μin 5.08μm
Radiation Hardening No
RoHS Status Non-RoHS Compliant
Flammability Rating UL94 V-0
Lead Free Contains Lead
Factory Lead Time 1 Week
Contact Material Copper
Mount Through Hole
Mounting Type Through Hole
Package / Case DIP
Insulation Material Polychlorinated
Housing Material Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
See Relate Datesheet

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