Parameters | |
---|---|
Factory Lead Time | 1 Week |
Contact Plating | Tin |
Mount | Through Hole |
Material | FR4 Epoxy Glass |
Package Accepted | SOIC |
Published | 2006 |
Series | Correct-A-Chip® 350000 |
Size / Dimension | 1.400Lx0.450W 35.56mmx11.43mm |
JESD-609 Code | e0 |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Termination | Solder |
ECCN Code | EAR99 |
Number of Positions | 14 |
Pitch | 0.050 1.27mm |
Number of Contacts | 14 |
Lead Length | 3.175mm |
Device Socket Type | IC SOCKET |
Proto Board Type | SMD to DIP |
Board Thickness | 0.062 1.57mm 1/16 |
RoHS Status | Non-RoHS Compliant |