Parameters | |
---|---|
Contact Material | Copper |
Mount | Through Hole |
Mounting Type | Through Hole |
Housing Material | Aluminum Alloy |
Number of Positions or Pins (Grid) | 6 (2 x 3) |
Contact Material - Mating | Beryllium Copper |
Contact Material - Post | Beryllium Copper |
Operating Temperature | -55°C~125°C |
Published | 2005 |
Series | 700 |
JESD-609 Code | e0 |
Feature | Carrier, Closed Frame |
Part Status | Obsolete |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Termination | Solder |
ECCN Code | EAR99 |
Type | DIP, 0.3 (7.62mm) Row Spacing |
Number of Rows | 2 |
Additional Feature | STANDARD PROFILE, VERTICAL MOUNT, DIP SOCKET |
Contact Finish - Mating | Gold |
Current Rating (Amps) | 3A |
Orientation | Straight |
Reach Compliance Code | unknown |
Pitch - Mating | 0.100 2.54mm |
Number of Contacts | 6 |
Contact Resistance | 10mOhm |
Termination Post Length | 0.125 3.18mm |
Pitch - Post | 0.100 2.54mm |
Height | 4.2mm |
Length | 7.62mm |
Width | 7.62mm |
Contact Finish Thickness - Mating | 20.0μin 0.51μm |
Contact Finish Thickness - Post | 20.0μin 0.51μm |
Material Flammability Rating | UL94 V-0 |
RoHS Status | RoHS Compliant |
Lead Free | Lead Free |