150-10-308-00-001101
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Contact Material | Brass |
| Mount | Through Hole |
| Mounting Type | Through Hole |
| Insulation Material | Polychlorinated |
| Housing Material | POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER |
| Packaging | Bulk |
| Published | 2011 |
| Series | 150 |
| JESD-609 Code | e4 |
| Pbfree Code | yes |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Termination | Solder |
| ECCN Code | EAR99 |
| Connector Type | DIP, DIL - Header |
| Max Operating Temperature | 125°C |
| Min Operating Temperature | -55°C |
| Color | Black |
| Number of Rows | 2 |
| Additional Feature | STANDARD: UL 94V-0 |
| Contact Type | Male Pin |
| Pitch | 0.100 2.54mm |
| Orientation | Straight |
| Depth | 10.1mm |
| Current Rating | 1A |
| Contact Finish | Gold |
| Number of Contacts | 8 |
| Row Spacing | 0.300 (7.62mm) |
| Number of Poles | 8 |
| Device Socket Type | IC SOCKET |
| Length | 10.1mm |
| Width | 10.1mm |
| Contact Finish Thickness | 10.0μin 0.25μm |
| Radiation Hardening | No |
| RoHS Status | ROHS3 Compliant |
See Relate Datesheet
