Parameters | |
---|---|
Factory Lead Time | 1 Week |
Lifecycle Status | IN PRODUCTION (Last Updated: 1 month ago) |
Mounting Type | Through Hole |
Package / Case | A, Axial |
Surface Mount | NO |
Diode Element Material | SILICON |
Packaging | Bulk |
Published | 1997 |
JESD-609 Code | e0 |
Pbfree Code | no |
Part Status | Discontinued |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 2 |
ECCN Code | EAR99 |
Terminal Finish | TIN LEAD |
Additional Feature | HIGH RELIABILITY |
HTS Code | 8541.10.00.80 |
Terminal Form | WIRE |
Peak Reflow Temperature (Cel) | NOT SPECIFIED |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
JESD-30 Code | O-LALF-W2 |
Operating Temperature (Max) | 175°C |
Number of Elements | 1 |
Configuration | SINGLE |
Speed | Standard Recovery >500ns, > 200mA (Io) |
Diode Type | Standard |
Current - Reverse Leakage @ Vr | 1μA @ 1000V |
Voltage - Forward (Vf) (Max) @ If | 1.1V @ 1A |
Case Connection | ISOLATED |
Operating Temperature - Junction | -65°C~175°C |
Output Current-Max | 1A |
Voltage - DC Reverse (Vr) (Max) | 1000V |
Current - Average Rectified (Io) | 1A |
Rep Pk Reverse Voltage-Max | 1000V |
RoHS Status | Non-RoHS Compliant |