1N4449
| Parameters | |
|---|---|
| Mounting Type | Through Hole |
| Package / Case | DO-204AH, DO-35, Axial |
| Surface Mount | NO |
| Diode Element Material | SILICON |
| Packaging | Bulk |
| Published | 1996 |
| JESD-609 Code | e0 |
| Pbfree Code | no |
| Part Status | Discontinued |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Number of Terminations | 2 |
| ECCN Code | EAR99 |
| Terminal Finish | TIN LEAD |
| Additional Feature | METALLURGICALLY BONDED |
| HTS Code | 8541.10.00.70 |
| Terminal Form | WIRE |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| JESD-30 Code | O-LALF-W2 |
| Qualification Status | Not Qualified |
| Operating Temperature (Max) | 150°C |
| Number of Elements | 1 |
| Configuration | SINGLE |
| Speed | Small Signal =< 200mA (Io), Any Speed |
| Diode Type | Standard |
| Current - Reverse Leakage @ Vr | 25nA @ 20V |
| Voltage - Forward (Vf) (Max) @ If | 1V @ 30mA |
| Case Connection | ISOLATED |
| Operating Temperature - Junction | -65°C~150°C |
| Output Current-Max | 0.2A |
| Voltage - DC Reverse (Vr) (Max) | 75V |
| Current - Average Rectified (Io) | 200mA |
| Reverse Recovery Time | 4ns |
| Non-rep Pk Forward Current-Max | 0.5A |
| Reverse Current-Max | 0.025μA |
| RoHS Status | Non-RoHS Compliant |
See Relate Datesheet
