1N6640US
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Contact Plating | Lead, Tin |
| Mount | Surface Mount |
| Mounting Type | Surface Mount |
| Package / Case | SQ-MELF, D |
| Number of Pins | 2 |
| Diode Element Material | SILICON |
| Packaging | Bulk |
| Published | 1999 |
| JESD-609 Code | e0 |
| Pbfree Code | no |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Number of Terminations | 2 |
| ECCN Code | EAR99 |
| Terminal Finish | TIN LEAD |
| Max Operating Temperature | 175°C |
| Min Operating Temperature | -65°C |
| HTS Code | 8541.10.00.70 |
| Terminal Position | END |
| Terminal Form | WRAP AROUND |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| Pin Count | 2 |
| Qualification Status | Not Qualified |
| Number of Elements | 1 |
| Element Configuration | Single |
| Speed | Fast Recovery =< 500ns, > 200mA (Io) |
| Diode Type | Standard |
| Current - Reverse Leakage @ Vr | 100nA @ 50V |
| Voltage - Forward (Vf) (Max) @ If | 1V @ 200mA |
| Case Connection | ISOLATED |
| Forward Current | 300mA |
| Operating Temperature - Junction | -65°C~175°C |
| Output Current-Max | 0.3A |
| Current - Average Rectified (Io) | 300mA DC |
| Forward Voltage | 1V |
| Max Reverse Voltage (DC) | 75V |
| Average Rectified Current | 300mA |
| Reverse Recovery Time | 4 ns |
| Max Repetitive Reverse Voltage (Vrrm) | 50V |
| Peak Non-Repetitive Surge Current | 2.5A |
| Reverse Current-Max | 0.1μA |
| RoHS Status | Non-RoHS Compliant |
See Relate Datesheet
