Parameters | |
---|---|
Terminal Finish | TIN LEAD |
Additional Feature | METALLURGICALLY BONDED |
HTS Code | 8541.10.00.50 |
Subcategory | Voltage Reference Diodes |
Max Power Dissipation | 500mW |
Technology | ZENER |
Terminal Position | END |
Terminal Form | WRAP AROUND |
Peak Reflow Temperature (Cel) | NOT SPECIFIED |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
Pin Count | 2 |
Qualification Status | Not Qualified |
Number of Elements | 1 |
Impedance | 15Ohm |
Element Configuration | Single |
Diode Type | ZENER DIODE |
Current - Reverse Leakage @ Vr | 2μA @ 3V |
Power Dissipation | 500mW |
Case Connection | ISOLATED |
Impedance-Max | 15Ohm |
Test Current | 7.5mA |
Reference Voltage | 6.2V |
Zener Voltage | 6.2V |
Voltage Tol-Max | 4.84% |
Voltage Tolerance | 5% |
Voltage Temp Coeff-Max | 0.031mV/°C |
RoHS Status | Non-RoHS Compliant |
Factory Lead Time | 1 Week |
Lifecycle Status | IN PRODUCTION (Last Updated: 3 weeks ago) |
Contact Plating | Lead, Tin |
Mount | Surface Mount |
Mounting Type | Surface Mount |
Package / Case | DO-213AA (Glass) |
Number of Pins | 2 |
Diode Element Material | SILICON |
Operating Temperature | -55°C~175°C |
Packaging | Bulk |
Published | 1999 |
Tolerance | ±5% |
JESD-609 Code | e0 |
Pbfree Code | no |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 2 |
ECCN Code | EAR99 |