Parameters | |
---|---|
Packaging | Bulk |
Published | 1999 |
JESD-609 Code | e0 |
Pbfree Code | no |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 2 |
ECCN Code | EAR99 |
Terminal Finish | TIN LEAD |
Additional Feature | METALLURGICALLY BONDED |
HTS Code | 8541.10.00.50 |
Max Power Dissipation | 500mW |
Technology | ZENER |
Terminal Form | WIRE |
Pin Count | 2 |
Number of Elements | 1 |
Impedance | 20Ohm |
Element Configuration | Single |
Diode Type | ZENER DIODE |
Current - Reverse Leakage @ Vr | 10μA @ 6V |
Power Dissipation | 500mW |
Case Connection | ISOLATED |
Impedance-Max | 20Ohm |
Test Current | 7.5mA |
Reference Voltage | 9V |
Zener Voltage | 9V |
Voltage Tol-Max | 5% |
Voltage Tolerance | 5% |
Voltage Temp Coeff-Max | 0.45mV/°C |
Radiation Hardening | No |
RoHS Status | Non-RoHS Compliant |
Factory Lead Time | 1 Week |
Lifecycle Status | IN PRODUCTION (Last Updated: 1 month ago) |
Contact Plating | Lead, Tin |
Mount | Through Hole |
Mounting Type | Through Hole |
Package / Case | DO-204AH, DO-35, Axial |
Number of Pins | 2 |
Diode Element Material | SILICON |
Operating Temperature | -65°C~175°C |