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1SX250LH3F55E1VG

0°C~100°C TJ System On ChipStratix? 10 SX Series 1160 I/O


  • Manufacturer: Intel
  • Nocochips NO: 386-1SX250LH3F55E1VG
  • Package: 2912-BBGA, FCBGA
  • Datasheet: PDF
  • Stock: 728
  • Description: 0°C~100°C TJ System On ChipStratix? 10 SX Series 1160 I/O(Kg)

Details

Tags

Parameters
Package / Case 2912-BBGA, FCBGA
Operating Temperature 0°C~100°C TJ
Packaging Tray
Series Stratix® 10 SX
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of I/O 1160
Speed 1.5GHz
RAM Size 256KB
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Peripherals DMA, WDT
Connectivity EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Primary Attributes FPGA - 2500K Logic Elements
RoHS Status RoHS Compliant

This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight? core processor(s).


A core processor(s) Quad ARM? Cortex?-A53 MPCore? with CoreSight? is integrated into this SoC.The manufacturer assigns this system on a chip with a 2912-BBGA, FCBGA package as per the manufacturer's specifications.With 256KB RAM implemented, this SoC chip provides users with a high level of performance.When it comes to internal architecture, this SoC design employs the MCU, FPGA technique.Stratix? 10 SX is the series name of this system on chip SoC.It is recommended that this SoC meaning be operated at 0°C~100°C TJ on an average.It is important to note that this SoC security combines FPGA - 2500K Logic Elements.In the state-of-the-art Tray package, this SoC system on a chip is housed.An integral part of this SoC consists of a total of 1160 I/Os.It uses MICROPROCESSOR CIRCUIT as a uPs/uCs/Peripheral SoC.

Quad ARM? Cortex?-A53 MPCore? with CoreSight? processor.


256KB RAM.
Built on MCU, FPGA.
MICROPROCESSOR CIRCUIT

There are a lot of Intel


1SX250LH3F55E1VG System On Chip (SoC) applications.

  • Keywords
  • Industrial automation devices
  • Industrial sectors
  • ARM
  • External USB hard disk/SSD
  • Functional safety for critical applications in the aerospace
  • Smart appliances
  • Published Paper
  • Digital Signal Processing
  • Wireless sensor networks

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