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1SX250LU2F50E2VG

0°C~100°C TJ System On ChipStratix? 10 SX Series 704 I/O


  • Manufacturer: Intel
  • Nocochips NO: 386-1SX250LU2F50E2VG
  • Package: 2397-BBGA, FCBGA
  • Datasheet: PDF
  • Stock: 879
  • Description: 0°C~100°C TJ System On ChipStratix? 10 SX Series 704 I/O(Kg)

Details

Tags

Parameters
Factory Lead Time 1 Week
Package / Case 2397-BBGA, FCBGA
Operating Temperature 0°C~100°C TJ
Packaging Tray
Series Stratix® 10 SX
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of I/O 704
Speed 1.5GHz
RAM Size 256KB
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Peripherals DMA, WDT
Connectivity EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Primary Attributes FPGA - 2500K Logic Elements
RoHS Status RoHS Compliant

This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight? core processor(s).


Based on the core processor(s) Quad ARM? Cortex?-A53 MPCore? with CoreSight?, this SoC has been developed.The manufacturer assigns this system on a chip with a 2397-BBGA, FCBGA package as per the manufacturer's specifications.A SoC chip with 256KB RAM is provided for users to enjoy reliable performance.The internal architecture of this SoC design is based on the MCU, FPGA technique.Stratix? 10 SX is the series number of this system on chip SoC.This SoC meaning should have an average operating temperature of 0°C~100°C TJ.It is important to note that this SoC security combines FPGA - 2500K Logic Elements.There is a state-of-the-art Tray package that houses this SoC system on a chip.704 I/Os are available in this SoC part.For its uPs/uCs/peripheral SoCs, it uses MICROPROCESSOR CIRCUIT.

Quad ARM? Cortex?-A53 MPCore? with CoreSight? processor.


256KB RAM.
Built on MCU, FPGA.
MICROPROCESSOR CIRCUIT

There are a lot of Intel


1SX250LU2F50E2VG System On Chip (SoC) applications.

  • Efficient hardware for training of neural networks
  • Apple smart watch
  • Microprocessors
  • Test and Measurement
  • Industrial transport
  • Microcontroller
  • String inverter
  • Avionics
  • Multiprocessor system-on-chips (MPSoCs)
  • Defense

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