1SX280LU3F50E3VG
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Package / Case | 2397-BBGA, FCBGA |
| Operating Temperature | 0°C~100°C TJ |
| Packaging | Tray |
| Series | Stratix® 10 SX |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of I/O | 704 |
| Speed | 1.5GHz |
| RAM Size | 256KB |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT |
| Core Processor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ |
| Peripherals | DMA, WDT |
| Connectivity | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Architecture | MCU, FPGA |
| Primary Attributes | FPGA - 2800K Logic Elements |
| RoHS Status | RoHS Compliant |
This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight? core processor(s).
On this SoC, there is Quad ARM? Cortex?-A53 MPCore? with CoreSight? core processor.Assigned with the package 2397-BBGA, FCBGA, this system on a chip comes from the manufacturer.This SoC chip is equipped with 256KB RAM and guarantees reliable performance to the user.Internally, this SoC design uses the MCU, FPGA technique.In the Stratix? 10 SX series, this system on chip SoC is included.Temperatures should be 0°C~100°C TJ on average for this SoC meaning.In addition, this SoC security combines FPGA - 2800K Logic Elements.Featured in the state-of-the-art Tray package, this SoC system on a chip provides outstanding performance.This SoC part has a total of 704 I/Os.This wireless SoC uses MICROPROCESSOR CIRCUIT as its uPs, uCs, and peripheral ICs.
Quad ARM? Cortex?-A53 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
MICROPROCESSOR CIRCUIT
There are a lot of Intel
1SX280LU3F50E3VG System On Chip (SoC) applications.
- Embedded systems
- Body control module
- Microcontroller
- Test and Measurement
- RISC-V
- Microprocessors
- Special Issue Information
- Efficient hardware for inference of neural networks
- Central inverter
- Personal Computers
