Parameters | |
---|---|
Contact Material | Copper |
Contact Plating | Tin |
Mount | Vertical |
Insulation Material | Polychlorinated |
Housing Material | POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER |
JESD-609 Code | e3 |
Pbfree Code | yes |
Termination | Through Hole |
ECCN Code | EAR99 |
Number of Positions | 8 |
Max Operating Temperature | 105°C |
Min Operating Temperature | -55°C |
Color | Brown |
Number of Rows | 2 |
Additional Feature | DIPLOMATE |
Contact Finish - Mating | TIN |
Pitch | 2.54mm |
Orientation | Straight |
Depth | 10.01mm |
Row Spacing - Mating | 7.87 mm |
Number of Contacts | 8 |
PCB Contact Pattern | RECTANGULAR |
Body Breadth | 0.394 inch |
Lead Length | 3.25mm |
Contact Style | DUAL PRONG |
Contact Resistance | 30mOhm |
Insulation Resistance | 10GOhm |
ELV | Compliant |
Dielectric Withstanding Voltage | 1000VAC V |
PCB Contact Row Spacing | 0.3 mm |
Device Socket Type | IC SOCKET |
Length | 10.03mm |
RoHS Status | RoHS Compliant |
Flammability Rating | UL94 V-0 |
Lead Free | Lead Free |