Parameters | |
---|---|
Mount | Through Hole |
Mounting Type | Through Hole |
Housing Material | Liquid Crystal Polymer (LCP) |
Number of Positions or Pins (Grid) | 370 (19 x 19) |
Contact Material - Mating | Copper Alloy |
Contact Material - Post | Copper Alloy |
Packaging | Tray |
JESD-609 Code | e3 |
Feature | Open Frame |
Part Status | Obsolete |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Termination | Solder |
ECCN Code | EAR99 |
Type | PGA, ZIF (ZIP) |
Additional Feature | LOW PROFILE |
HTS Code | 8536.69.40.40 |
Contact Finish - Mating | Gold |
Orientation | Straight |
Pitch - Mating | 0.100 2.54mm |
Number of Contacts | 370 |
Housing Color | Natural |
Insulation Resistance | 5GOhm |
ELV | Compliant |
Termination Post Length | 0.093 2.36mm |
Pitch - Post | 0.100 2.54mm |
Contact Finish Thickness - Mating | 30.0μin 0.76μm |
Contact Finish Thickness - Post | 30.0μin 0.76μm |
Material Flammability Rating | UL94 V-0 |
RoHS Status | RoHS Compliant |
Flammability Rating | UL94 V-0 |