Parameters | |
---|---|
Contact Material | Bronze |
Mount | Vertical |
Mounting Type | Through Hole |
Package / Case | SOIC |
Insulation Material | Thermoplastic |
Housing Material | Thermoplastic, Glass Filled |
Number of Positions or Pins (Grid) | 24 (2 x 12) |
Contact Material - Mating | Phosphor Bronze |
Contact Material - Post | Phosphor Bronze |
Operating Temperature | -55°C~125°C |
Packaging | Tube |
Published | 2005 |
Series | Diplomate DL |
JESD-609 Code | e0 |
Feature | Open Frame |
Pbfree Code | no |
Part Status | Obsolete |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Termination | Solder |
ECCN Code | EAR99 |
Type | DIP, 0.6 (15.24mm) Row Spacing |
Color | Black |
Number of Rows | 2 |
Additional Feature | STANDARD: UL 94V-0 |
HTS Code | 8536.69.40.40 |
Contact Finish - Mating | Gold |
Orientation | Straight |
Depth | 17.63mm |
Pitch - Mating | 0.100 2.54mm |
Lead Pitch | 2.54mm |
Number of Contacts | 24 |
PCB Contact Pattern | RECTANGULAR |
Body Breadth | 0.694 inch |
Lead Length | 3.25mm |
Contact Style | BELLOWED TYPE |
Contact Resistance | 30mOhm |
Insulation Resistance | 10GOhm |
Row Spacing | 15.49 mm |
Mating Contact Pitch | 0.1 inch |
ELV | Non-Compliant |
Dielectric Withstanding Voltage | 1000VAC V |
Data Rate | 250 kbps |
Receiver Hysteresis | 25 mV |
Termination Post Length | 0.128 3.24mm |
Pitch - Post | 0.100 2.54mm |
Simplex/Duplex | Half Duplex |
Length | 30.35mm |
Width | 17.63mm |
Contact Finish Thickness - Mating | 15.0μin 0.38μm |
Contact Finish Thickness - Post | 15.0μin 0.38μm |
Material Flammability Rating | UL94 V-0 |
Radiation Hardening | No |
RoHS Status | Non-RoHS Compliant |
Flammability Rating | UL94 V-0 |