Parameters | |
---|---|
Mount | Through Hole |
Mounting Type | Through Hole |
Number of Pins | 16 |
Insulation Material | Polychlorinated |
Housing Material | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
Number of Positions or Pins (Grid) | 16 (2 x 8) |
Contact Material - Mating | Beryllium Copper |
Contact Material - Post | Brass Alloy |
Operating Temperature | -55°C~125°C |
Packaging | Tube |
Series | 210 |
JESD-609 Code | e0 |
Feature | Closed Frame |
Pbfree Code | no |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Termination | Solder |
ECCN Code | EAR99 |
Type | DIP, 0.3 (7.62mm) Row Spacing |
Number of Rows | 2 |
Additional Feature | DIP SOCKET, LOW PROFILE |
HTS Code | 8536.90.40.00 |
Voltage - Rated DC | 150V |
Contact Finish - Mating | Tin-Lead |
Orientation | Straight |
Depth | 10.1mm |
Current Rating | 3A |
Pitch - Mating | 0.100 2.54mm |
Voltage - Rated AC | 100V |
Number of Contacts | 16 |
Contact Resistance | 10mOhm |
Insulation Resistance | 10GOhm |
Row Spacing | 7.62 mm |
Termination Post Length | 0.125 3.18mm |
Pitch - Post | 0.100 2.54mm |
Length | 20.3mm |
Width | 10.2mm |
Contact Finish Thickness - Mating | 100.0μin 2.54μm |
Contact Finish Thickness - Post | 200.0μin 5.08μm |
RoHS Status | Non-RoHS Compliant |
Factory Lead Time | 1 Week |
Contact Plating | Tin |