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214-99-318-01-670800

CONN IC DIP SOCKET 18POS TINLEAD


  • Manufacturer: Mill-Max Manufacturing Corp.
  • Nocochips NO: 520-214-99-318-01-670800
  • Package: DIP
  • Datasheet: -
  • Stock: 358
  • Description: CONN IC DIP SOCKET 18POS TINLEAD (Kg)

Details

Tags

Parameters
Factory Lead Time 1 Week
Contact Material Copper
Contact Plating Tin
Mount Surface Mount
Mounting Type Surface Mount
Package / Case DIP
Insulation Material Nylon
Housing Material Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Number of Positions or Pins (Grid) 18 (2 x 9)
Contact Material - Mating Beryllium Copper
Contact Material - Post Brass Alloy
Operating Temperature -55°C~125°C
Packaging Tube
Published 2000
Series 214
JESD-609 Code e0
Feature Closed Frame
Pbfree Code no
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
ECCN Code EAR99
Type DIP, 0.3 (7.62mm) Row Spacing
Number of Positions 18
Number of Rows 2
HTS Code 8536.90.40.00
Contact Finish - Mating Tin-Lead
Orientation Straight
Depth 10.1mm
Current Rating 3A
Pitch - Mating 0.100 2.54mm
Lead Pitch 2.54mm
Number of Contacts 18
Contact Resistance 10mOhm
Row Spacing 7.62 mm
Max Current Rating 3A
Termination Post Length 0.056 1.42mm
Pitch - Post 0.100 2.54mm
Length 22.86mm
Width 10.16mm
Contact Finish Thickness - Mating 100.0μin 2.54μm
Contact Finish Thickness - Post 200.0μin 5.08μm
RoHS Status Non-RoHS Compliant
Lead Free Contains Lead
See Relate Datesheet

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