2327670-3
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Contact Material | Copper Alloy |
| Mounting Type | Surface Mount, Right Angle |
| Material - Insulation | Liquid Crystal Polymer (LCP) |
| Operating Temperature | -55°C~85°C |
| Packaging | Tape & Reel (TR) |
| Series | Sliver 2.0 |
| Feature | Board Guide, Pick and Place, Solder Retention |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | Not Applicable |
| Termination | Solder |
| Number of Positions | 140 |
| Color | Black |
| Number of Rows | 2 |
| Gender | Female |
| Pitch | 0.024 0.60mm |
| Contact Finish | Gold |
| Card Type | Non Specified - Dual Edge |
| Read Out | Dual |
| Number of Positions/Bay/Row | 28; 14; 28 |
| Contact Finish Thickness | 30.0μin 0.76μm |
| Card Thickness | 0.062 1.57mm |
| RoHS Status | RoHS Compliant |
2327670-3 Overview
As per Tape & Reel (TR)'s specifications, the material was packaged.It's best to mount type Surface Mount, Right Angle.Board Guide, Pick and Place, Solder Retention features are on this device.Device series is indicated by Sliver 2.0.
2327670-3 Features
Sliver 2.0 series
2327670-3 Applications
There are a lot of TE Connectivity AMP Connectors 2327670-3 Edgeboard Connectors applications.
- 4-channel data acquisition
- AC motor control
- Digital signal processing
- Automotive
- Telecommunications
- Uninterrupted Power Supplies
- Multicarrier, multimode digital receivers
- CMOS Image sensors for mobile applications
- Transducer
- Industrial Process Control
