2327677-3
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Contact Material | Copper Alloy |
| Mounting Type | Surface Mount |
| Material - Insulation | Liquid Crystal Polymer (LCP) |
| Operating Temperature | -55°C~85°C |
| Packaging | Tape & Reel (TR) |
| Series | Sliver 2.0 |
| Feature | Board Guide, Pick and Place, Solder Retention |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | Not Applicable |
| Termination | Solder |
| Number of Positions | 140 |
| Color | Black |
| Number of Rows | 2 |
| Gender | Female |
| Pitch | 0.024 0.60mm |
| Contact Finish | Gold |
| Card Type | Non Specified - Dual Edge |
| Read Out | Dual |
| Number of Positions/Bay/Row | 28; 14; 28 |
| Contact Finish Thickness | 30.0μin 0.76μm |
| Card Thickness | 0.062 1.57mm |
| RoHS Status | RoHS Compliant |
2327677-3 Overview
Packaged according to Tape & Reel (TR)'s specs.The mounting type Surface Mount should be used.Board Guide, Pick and Place, Solder Retention features are available on the device.Sliver 2.0 tells you what series the device is.
2327677-3 Features
Sliver 2.0 series
2327677-3 Applications
There are a lot of TE Connectivity AMP Connectors 2327677-3 Edgeboard Connectors applications.
- Handheld Terminal Interface
- Microcontrollers.
- Scientific instruments
- High Speed Data Acquisition for PCs
- Digital signal processing
- Medical Instrumentation and medical imaging
- Wireless and wired broadband communications
- Multicarrier, multimode digital receivers
- Instrumentation and test equipment
- Data Acquisition Systems
