2327678-2
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Contact Material | Copper Alloy |
| Mounting Type | Surface Mount |
| Material - Insulation | Liquid Crystal Polymer (LCP) |
| Operating Temperature | -55°C~85°C |
| Packaging | Tape & Reel (TR) |
| Series | Sliver 2.0 |
| Feature | Board Guide, Pick and Place, Solder Retention |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | Not Applicable |
| Termination | Solder |
| Number of Positions | 84 |
| Color | Black |
| Number of Rows | 2 |
| Gender | Female |
| Pitch | 0.024 0.60mm |
| Contact Finish | Gold |
| Card Type | Non Specified - Dual Edge |
| Read Out | Dual |
| Number of Positions/Bay/Row | 28; 14 |
| Contact Finish Thickness | 15.0μin 0.38μm |
| Card Thickness | 0.062 1.57mm |
| RoHS Status | RoHS Compliant |
2327678-2 Overview
The material was packaged according to the specifications provided by Tape & Reel (TR).There is a recommendation to mount using type Surface Mount.Features: Board Guide, Pick and Place, Solder Retention.It is indicated by Sliver 2.0 that the device is a series device.
2327678-2 Features
Sliver 2.0 series
2327678-2 Applications
There are a lot of TE Connectivity AMP Connectors 2327678-2 Edgeboard Connectors applications.
- Medical Instrumentation and medical imaging
- Wireless and wired broadband communications
- Rotary encoder
- Communications
- Imaging Systems
- High Speed Data Acquisition for PCs
- Telecommunications
- High Speed Data Acquisition
- Transducer
- Music reproduction technology
