Parameters |
Factory Lead Time |
1 Week |
Contact Material |
Copper Alloy |
Mounting Type |
Surface Mount |
Material - Insulation |
Liquid Crystal Polymer (LCP) |
Packaging |
Tape & Reel (TR) |
Series |
Sliver 2.0 |
Feature |
Board Guide, Pick and Place, Solder Retention |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
Not Applicable |
Termination |
Solder |
Number of Positions |
56 |
Color |
Black |
Number of Rows |
2 |
Gender |
Female |
Pitch |
0.024 0.60mm |
Contact Finish |
Gold |
Card Type |
Non Specified - Dual Edge |
Read Out |
Dual |
Number of Positions/Bay/Row |
28 |
Contact Finish Thickness |
15.0μin 0.38μm |
Card Thickness |
0.062 1.57mm |
RoHS Status |
ROHS3 Compliant |
2332141-2 Overview
Packaging was done per Tape & Reel (TR)'s specs.A mounting type of Surface Mount is recommended.It has Board Guide, Pick and Place, Solder Retention features.In this case, the Sliver 2.0 indicates the series of the device.
2332141-2 Features
Sliver 2.0 series
2332141-2 Applications
There are a lot of TE Connectivity AMP Connectors 2332141-2 Edgeboard Connectors applications.
- 4-channel data acquisition
- In-building wireless telephony
- High Speed Data Acquisition
- Instrumentation and test equipment
- 3-phase power control
- Communications
- AC motor control
- Multicarrier, multimode digital receivers
- Scientific instruments.
- Audio/Video devices