2332208-3
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Contact Material | Copper Alloy |
| Mounting Type | Surface Mount, Right Angle |
| Material - Insulation | Liquid Crystal Polymer (LCP) |
| Packaging | Tape & Reel (TR) |
| Series | Sliver 2.0 |
| Feature | Board Guide, Pick and Place, Solder Retention |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | Not Applicable |
| Termination | Solder |
| Number of Positions | 56 |
| Color | Black |
| Number of Rows | 2 |
| Gender | Female |
| Pitch | 0.024 0.60mm |
| Contact Finish | Gold |
| Card Type | Non Specified - Dual Edge |
| Read Out | Dual |
| Number of Positions/Bay/Row | 28 |
| Contact Finish Thickness | 30.0μin 0.76μm |
| Card Thickness | 0.062 1.57mm |
| RoHS Status | ROHS3 Compliant |
2332208-3 Overview
Material was packaged in accordance with Tape & Reel (TR)'s specifications.We recommend mounting type Surface Mount, Right Angle.Currently, the device offers Board Guide, Pick and Place, Solder Retention features.Device series Sliver 2.0 is indicated by the Sliver 2.0.
2332208-3 Features
Sliver 2.0 series
2332208-3 Applications
There are a lot of TE Connectivity AMP Connectors 2332208-3 Edgeboard Connectors applications.
- Digital beam-forming systems for ultrasound
- RADAR processing, digital oscilloscopes
- Communications
- Communication test equipment
- Digital Multimeters, PLC's (Programming Logic Controllers)
- Digital Storage Oscilloscope
- Telecommunications
- GSM, EDGE, PHS, UMTS, WCDMA, CDMA2000,
- Micro and pico cell systems, software radios
- Broadband data applications
