239-5605-01-0602
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Mount | Through Hole |
| Mounting Type | Through Hole |
| Package / Case | 0602 |
| Number of Pins | 39 |
| Housing Material | Polysulfone (PSU), Glass Filled |
| Number of Positions or Pins (Grid) | 39 (1 x 19, 1 x 20) |
| Contact Material - Mating | Beryllium Copper |
| Contact Material - Post | Beryllium Copper |
| Operating Temperature | -55°C~150°C |
| Packaging | Bulk |
| Published | 2001 |
| Feature | Closed Frame |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Termination | Solder |
| Type | Zig-Zag |
| Gender | Female |
| Contact Finish - Mating | Gold |
| Current Rating (Amps) | 1A |
| Pitch - Mating | 0.100 2.54mm |
| Contact Resistance | 25mOhm |
| Termination Post Length | 0.100 2.54mm |
| Pitch - Post | 0.100 2.54mm |
| Contact Finish Thickness - Mating | 30.0μin 0.76μm |
| Contact Finish Thickness - Post | 30.0μin 0.76μm |
| Material Flammability Rating | UL94 V-0 |
| RoHS Status | RoHS Compliant |
See Relate Datesheet
