24-350000-11-RC
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Contact Material | Brass |
| Contact Plating | Gold |
| Mount | Through Hole |
| Material | FR4 Epoxy Glass |
| Package Accepted | SOIC |
| Published | 2006 |
| Series | Correct-A-Chip® 350000 |
| Size / Dimension | 2.400Lx0.450W 60.96mmx11.43mm |
| JESD-609 Code | e4 |
| Feature | High Temperature |
| Pbfree Code | yes |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Termination | Solder |
| ECCN Code | EAR99 |
| Number of Positions | 24 |
| Max Operating Temperature | 200°C |
| Number of Rows | 2 |
| Additional Feature | SOCKET ADAPTER |
| Pitch | 0.050 1.27mm |
| Orientation | Straight |
| Depth | 11.68mm |
| Number of Contacts | 24 |
| Row Spacing | 7.62 mm |
| Device Socket Type | IC SOCKET |
| Proto Board Type | SMD to DIP |
| Height | 2.09mm |
| Board Thickness | 0.062 1.57mm 1/16 |
| REACH SVHC | No SVHC |
| RoHS Status | ROHS3 Compliant |
| Lead Free | Lead Free |
See Relate Datesheet
