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24-6553-10

CONN IC DIP SOCKET ZIF 24POS TIN


  • Manufacturer: Aries Electronics
  • Nocochips NO: 90-24-6553-10
  • Package: -
  • Datasheet: PDF
  • Stock: 248
  • Description: CONN IC DIP SOCKET ZIF 24POS TIN (Kg)

Details

Tags

Parameters
Factory Lead Time 1 Week
Mounting Type Through Hole
Housing Material Polyphenylene Sulfide (PPS), Glass Filled
Number of Positions or Pins (Grid) 24 (2 x 12)
Contact Material - Mating Beryllium Copper
Contact Material - Post Beryllium Copper
Packaging Bulk
Published 2013
Series 55
JESD-609 Code e3
Feature Closed Frame
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
ECCN Code EAR99
Type DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing
Additional Feature STANDARD: UL 94V-0
Contact Finish - Mating Tin
Current Rating (Amps) 1A
Pitch - Mating 0.100 2.54mm
Number of Contacts 24
Termination Post Length 0.110 2.78mm
Pitch - Post 0.100 2.54mm
Contact Finish Thickness - Mating 200.0μin 5.08μm
Contact Finish Thickness - Post 200.0μin 5.08μm
Material Flammability Rating UL94 V-0
RoHS Status ROHS3 Compliant
See Relate Datesheet

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