24-6573-11
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Mounting Type | Through Hole |
| Housing Material | Polyphenylene Sulfide (PPS), Glass Filled |
| Number of Positions or Pins (Grid) | 24 (2 x 12) |
| Contact Material - Mating | Beryllium Copper |
| Contact Material - Post | Beryllium Copper |
| Packaging | Bulk |
| Published | 2005 |
| Series | 57 |
| JESD-609 Code | e4 |
| Feature | Closed Frame |
| Pbfree Code | yes |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Termination | Solder |
| ECCN Code | EAR99 |
| Type | DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing |
| Additional Feature | STANDARD: UL 94V-0 |
| Contact Finish - Mating | Gold |
| Current Rating (Amps) | 1A |
| Terminal Pitch | 2.54mm |
| Pitch - Mating | 0.100 2.54mm |
| Body Length or Diameter | 1.79 inch |
| Number of Contacts | 24 |
| PCB Contact Pattern | RECTANGULAR |
| Operating Temperature (Max) | 150°C |
| Body Breadth | 0.9 inch |
| Body Depth | 0.47 inch |
| Contact Style | SQ PIN-SKT |
| Insulation Resistance | 1000000000Ohm |
| Mating Contact Pitch | 0.1 inch |
| Dielectric Withstanding Voltage | 1000VAC V |
| PCB Contact Row Spacing | 0.6 mm |
| Termination Post Length | 0.110 2.78mm |
| Pitch - Post | 0.100 2.54mm |
| Contact Finish Thickness - Mating | 10.0μin 0.25μm |
| Contact Finish Thickness - Post | 10.0μin 0.25μm |
| Material Flammability Rating | UL94 V-0 |
| RoHS Status | ROHS3 Compliant |
See Relate Datesheet
